BGA, uBGA, LGA, QFN, QFP, MLF, LCC & CSP Sockets and Adapters
CSP/Ballnest™ Hybrid Socket


Any grid size available on 0.30mm pitch or larger

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CSP/uBGA Test & Burn-In Socket for Devices Up to 6.5mm Square

For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications

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CSP/uBGA Test & Burn-In Socket for Devices up to 13mm Square

For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices.

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CSP/uBGA Test & Burn-in Socket for Devices from 14-27mm Square

For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications

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CSP/uBGA Test & Burn-in Socket w/Adjustable Pressure Pad

For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices. For Devices up to 27mm Square

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CSP/uBGA Test & Burn-in Socket for Devices up to 40mm Square

For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices

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CSP/uBGA Test & Burn-In Socket

For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices. For Devices up to 55mm Square

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Kelvin Test Socket


Low resistance testing using dual independent Aries Kelvin spring probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices.

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