BGA, uBGA, LGA, QFN, QFP, MLF, LCC & CSP Sockets and Adapters
CSP/uBGA Test & Burn-In Socket for Devices Up to 6.5mm Square
For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications
Download DatasheetCSP/uBGA Test & Burn-In Socket for Devices up to 13mm Square
For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices.
Download DatasheetCSP/uBGA Test & Burn-in Socket for Devices from 14-27mm Square
For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications
Download DatasheetCSP/uBGA Test & Burn-in Socket w/Adjustable Pressure Pad
For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices. For Devices up to 27mm Square
Download DatasheetCSP/uBGA Test & Burn-in Socket for Devices up to 40mm Square
For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices
Download DatasheetCSP/uBGA Test & Burn-In Socket
For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices. For Devices up to 55mm Square
Download DatasheetKelvin Test Socket
Low resistance testing using dual independent Aries Kelvin spring probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices.
Download Datasheet