High-Frequency (RF) Test Sockets
RF Test Socket w/Replaceable Contact Strips
User replaceable patented Microstrip contacts which lie flat on the DUT board, and become part of the transmission line decreasing down-time.
Download DatasheetThermoelectric-cooled RF Test Socket
Peltier Technology incorporated into test socket lid assembly.
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High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square
For test & dynamic burn-in of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices
Download DatasheetHigh-Frequency Center Probe Test Socket for Devices up to 13mm Square
For Test & Dynamic Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices
Download DatasheetHigh-Frequency Center Probe Test Socket for Devices up to 27mm Square
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz!
Download DatasheetHigh-Frequency Center Probe Test Socket w/Adjustable Pressure Pad for Devices
For Test & Dynamic Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Up to 27mm square.
Download DatasheetMachined High-Frequency Center Probe Test Socket for BGA, CSP, & MLF Packages
Solderless spring probes pressure mount to the test board and device solder ball or pad
Download DatasheetHigh-Frequency Center Probe Test Socket for Devices up to 40mm Square
For Test & Burn-In of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash Devices
Download DatasheetHigh-Frequency Center Probe Test Socket
For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices. For devices up to 55mm square.
Download DatasheetKelvin Test Socket
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Low resistance testing using dual independent Aries Kelvin spring probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices.
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